Thermal Properties & Thermal Shock

thermal conductivity

Thermal conductivity tells you how fast heat flows through a material when one side is hotter than the other. Fourier's law puts it simply: the heat flux q equals -k times the temperature gradient dT/dx, where k is the thermal conductivity. A high k means heat races through (a metal spoon in hot soup gets hot fast); a low k means heat crawls (a ceramic tile handle stays cool). Ceramics are remarkable because they span the whole range: some are among the best insulators known, and a few are better heat conductors than most metals.

The key to understanding ceramics is that in an electrically insulating solid there are no free electrons to carry heat the way they do in a metal. Instead heat is carried by the lattice vibrations themselves — by phonons, the packets of coordinated atomic jiggle. Simple kinetic theory gives k roughly equal to one-third of C times v times l, where C is the heat capacity, v is the phonon speed (essentially the speed of sound in the solid), and l is the mean free path a phonon travels before it is scattered off course. To conduct heat well a ceramic therefore wants light atoms and stiff bonds (high v), and a clean, simple, defect-free structure so phonons travel far (long l).

This single formula explains the whole range. Diamond, with the lightest strong-bonded atoms and a perfect simple lattice, reaches about 2000 W/m/K; silicon carbide around 120, aluminium nitride up to about 200, and beryllia near 250 — these are used as heat-spreading substrates precisely because they conduct like metals while insulating electrically. At the other end, glasses conduct around 1 W/m/K and stabilized zirconia only about 2, because disorder and heavy, dissimilar atoms scatter phonons after barely one interatomic hop. Add porosity and you can push an insulating firebrick below 0.1 W/m/K. That controllable range is why the same class of material makes both a red-hot furnace lining and the cool substrate under a power chip.

Aluminium nitride (AlN) substrates carry heat at about 170 to 200 W/m/K while insulating electrically, so power electronics dump their heat sideways into a heat sink through the AlN. Swap in alumina (about 30 W/m/K) and the chip runs far hotter for the same footprint — a direct payoff of the phonon-transport physics.

Choosing a high-conductivity insulating ceramic like AlN or SiC lets a part carry heat away without carrying current — a combination metals cannot offer.

High thermal conductivity does not require metallic bonding or free electrons: the best-conducting ceramics move heat entirely by phonons, so purity and crystalline perfection matter more than any electronic property.

Also called
thermal conductivity coefficientkkappa導熱係數熱導率